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INTEGRATED CIRCUITS
DATA SHEET
TDA1564J Run-cool stereo power amplifier
Preliminary specification File under Integrated Circuits, IC01 2002 Jan 14
Philips Semiconductors
Preliminary specification
Run-cool stereo power amplifier
FEATURES * Low dissipation due to switching from Single-Ended (SE) to Bridge-Tied Load (BTL) mode * Differential inputs with high Common Mode Rejection Ratio (CMRR) * Mute/standby/operating (mode select pin) * Load dump protection circuit * Short-circuit safe to ground, to supply voltage and across load * Loudspeaker protection circuit * Offset detection for each channel * Device switches to single-ended operation at excessive junction temperatures * Thermal protection at high junction temperature (170C) * Clip detection at THD = 2.5% * Diagnostic information (clip/protection/prewarning/offset). QUICK REFERENCE DATA SYMBOL VP PARAMETER supply voltage CONDITIONS DC biased non-operating load dump IORM Iq(tot) Istb Zi Po repetitive peak output current total quiescent current standby current input impedance output power RL = 4 ; EIAJ RL = 4 ; THD = 10% RL = 4 ; THD = 2.5% Gv CMRR SVRR VO cs Gv voltage gain common mode rejection ratio supply voltage ripple rejection DC output offset voltage channel separation channel unbalance Rs = 0 f = 1 kHz; Rs = 0 f = 1 kHz; Rs = 0 RL = MIN. 6.0 - - - - - 90 - 23 18 25 - 45 - 40 - GENERAL DESCRIPTION
TDA1564J
The TDA1564J is a monolithic power amplifier in a 17-lead single-in-line (SIL) plastic power package. It contains two identical 25 W amplifiers. The dissipation is minimized by switching from SE to BTL mode, only when a higher output voltage swing is needed. The device is primarily developed for car radio applications.
TYP. 14.4 - - - 95 1 120 38 25 20 26 80 65 - 70 -
MAX. 18 30 45 4 150 50 150 - - - 27 - - 100 - 1
UNIT V V V A mA A k W W W dB dB dB mV dB dB
ORDERING INFORMATION TYPE NUMBER TDA1564J PACKAGE NAME DBS17P DESCRIPTION plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) VERSION SOT243-1
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Philips Semiconductors
Preliminary specification
Run-cool stereo power amplifier
BLOCK DIAGRAM
TDA1564J
handbook, full pagewidth
VP1 5
VP2 13
TDA1564J
+
SLAVE CONTROL 10
- -
OUT2 -
MUTE IN2 - IN2 + 16
-
VI
IV
11
OUT2 +
+ -
VI
17
+
60 k 60 k 25 k Vref
+
VP 4
CIN
3
- +
CSE
60 k IN1- IN1+ 2
60 k VI
+ +
VI
- +
IV 7 OUT1-
1 MUTE
- - -
SLAVE CONTROL
8
OUT1+
+
STANDBY LOGIC 6
CLIP/PROTECTION TEMP PREWARNING 15
OFFSET DETECTION 14 12 9
MGW244
MODE
DIAG
OC1
OC2
GND
Fig.1 Block diagram.
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Philips Semiconductors
Preliminary specification
Run-cool stereo power amplifier
PINNING SYMBOL IN1+ IN1- CIN CSE VP1 MODE OUT1- OUT1+ GND OUT2- OUT2+ OC2 VP2 OC1 DIAG IN2- IN2+ PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 DESCRIPTION non-inverting input 1 inverting input 1 common input electrolytic capacitor for single-ended (SE) mode supply voltage 1 mute/standby/operating inverting output 1 non-inverting output 1 ground inverting output 2 non-inverting output 2 offset capacitor 2 supply voltage 2 offset capacitor 1 diagnostic inverting input 2 non-inverting input 2
GND
handbook, halfpage
TDA1564J
IN1+ IN1- CIN CSE VP1 MODE OUT1- OUT1+
1 2 3 4 5 6 7 8 9
TDA1564J
OUT2 - 10 OUT2 + 11 OC2 12 VP2 13 OC1 14 DIAG 15 IN2 - 16 IN2 + 17
MGW245
Fig.2 Pin configuration.
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Philips Semiconductors
Preliminary specification
Run-cool stereo power amplifier
FUNCTIONAL DESCRIPTION The TDA1564J contains two identical amplifiers with differential inputs. At low output power [up to output amplitudes of 3 V (RMS) at VP = 14.4 V], the device operates as a normal SE amplifier. When a larger output voltage swing is needed, the circuit switches internally to BTL operation. With a sine wave input signal, the dissipation of a conventional BTL amplifier (up to 2 W output power) is more than twice the dissipation of the TDA1564J; see Fig.10. In normal use, when the amplifier is driven with music-like signals, the high (BTL) output power is only needed for a small percentage of time. Assuming that a music signal has a normal (Gaussian) amplitude distribution, the dissipation of a conventional BTL amplifier with the same output power is approximately 70% higher (see Fig.11). The heatsink has to be designed for use with music signals. With such a heatsink, the thermal protection will disable the BTL mode when the junction temperature exceeds 150 C. In this case, the output power is limited to 5 W per amplifier. The gain of each amplifier is internally fixed at 26 dB. The device can be switched to the following modes via the MODE pin: * Standby with low standby current (<50 A) * Mute condition, DC adjusted * On, operation. The device is fully protected against a short-circuit of the output pins to ground and to the supply voltage. It is also protected against a short-circuit of the loudspeaker and against high junction temperatures. In the event of a permanent short-circuit condition to ground or the supply voltage, the output stage will be switched off, causing low dissipation. With a permanent short-circuit of the loudspeaker, the output stage will be repeatedly switched on and off. The duty cycle in the `on' condition is low enough to prevent excessive dissipation. The device also has two independent DC offset detection circuits that can detect DC output voltages across the speakers. With a DC offset greater than 2 V, a warning is given on the diagnostic pin. There will be no internal shutdown with DC offsets.
TDA1564J
When the supply voltage drops below 6 V (e.g. engine start), the circuit mutes immediately, avoiding clicks from the electronic circuit preceding the power amplifier. The voltage of the SE electrolytic capacitor (pin 4) is kept at 0.5VP by means of a voltage buffer (see Fig.1). The value of this capacitor has an important influence on the output power in SE mode, especially at low signal frequencies. A high value is recommended to minimize dissipation at low frequencies. The diagnostic output is an open-collector output and requires a pull-up resistor. It gives the following outputs: * Clip detection at THD = 2.5% * Short-circuit protection: - When a short-circuit occurs (for at least 10 s) at the outputs to ground or the supply voltage, the output stages are switched off to prevent excessive dissipation; the outputs are switched on again approximately 500 ms after the short-circuit is removed, during this short-circuit condition the protection pin is LOW - When a short-circuit occurs across the load (for at least 10 s), the output stages are switched off for approximately 500 ms; after this time, a check is made to see whether the short-circuit is still present - The power dissipation in any short-circuit condition is very low. * During start-up/shutdown, when the product is internally muted * Temperature prewarning: - A prewarning (junction temperature > 145 C) indicates that the temperature protection will become active. The prewarning can be used to reduce the input signal and thus reduce the power dissipation * Offset detection: - One of the channels has a DC output voltage greater than 2 V.
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Philips Semiconductors
Preliminary specification
Run-cool stereo power amplifier
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VP PARAMETER supply voltage CONDITIONS operating non-operating load dump; tr > 2.5 ms VP(sc) Vrp IORM Ptot Tstg Tvj Tamb short-circuit safe voltage reverse polarity voltage repetitive peak output current total power dissipation storage temperature virtual junction temperature ambient temperature - - - - - - - -55 - -40 MIN.
TDA1564J
MAX. 18 30 45 18 6 4 60 +150 150 - V V V V V A
UNIT
W C C C
THERMAL CHARACTERISTICS SYMBOL Rth(j-c) Rth(j-a) Note 1. The value of Rth(c-h) depends on the application (see Fig.3). Heatsink design There are two parameters that determine the size of the heatsink. The first is the rating for the virtual junction temperature and the second is the ambient temperature at which the amplifier must still deliver its full power in the BTL mode. With a conventional BTL amplifier, the maximum power dissipation with a music-like signal (at each amplifier) will be approximately two times 6.5 W. At a virtual junction temperature of 150 C and a maximum ambient temperature of 65 C, Rth(vj-c) = 1.3 K/W and Rth(c-h) = 0.2 K/W, the thermal resistance of the heatsink 150 - 65 should be: --------------------- - 1.3 - 0.2 = 5 K/W 2 x 6.5 Compared to a conventional BTL amplifier, the TDA1564J has a higher efficiency. The thermal resistance of the heatsink should be: 145 - 65 1.7 --------------------- - 1.3 - 0.2 = 9 K/W 2 x 6.5 -
0.1 K/W
handbook, halfpage
PARAMETER thermal resistance from junction to case thermal resistance from junction to ambient
CONDITIONS note 1 in free air
VALUE 1.3 40
UNIT K/W K/W
virtual junction OUT 1 OUT 2 OUT 2
OUT 1
3.6 K/W
3.6 K/W 3.6 K/W
3.6 K/W
0.6 K/W
0.6 K/W
MGC424
case
Fig.3 Thermal equivalent resistance network.
2002 Jan 14
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Philips Semiconductors
Preliminary specification
Run-cool stereo power amplifier
DC CHARACTERISTICS VP = 14.4 V; Tamb = 25 C; measured in Fig.7; unless otherwise specified. SYMBOL Supplies VP Iq(tot) Istb VCSE VO supply voltage total quiescent current standby current average electrolytic capacitor voltage at pin 4 DC output offset voltage on state mute state Mode select switch (see Fig.4) VMODE voltage at mode select pin standby condition mute condition on condition IMODE(sw) Diagnostic VDIAG IDIAG VO(DC) Protection Tpre Tdis(BTL) Notes 1. The circuit is DC biased at VP = 6 to 18 V and AC operating at VP = 8 to 18 V. 2. If the junction temperature exceeds 150C, the output power is limited to 5 W per channel. prewarning temperature BTL disable temperature note 2 - - 145 150 output voltage at the diagnostic output pin current through the diagnostic pin DC output voltage detection levels IDIAG = 2 mA; during any fault - condition or clip detect during any fault condition or clip detect 2 1.4 - - 2 switch current through pin 6 VMODE = 5 V 0 2 4 - - - 5 25 note 1 RL = 6.0 - - - - - 14.4 95 1 7.1 - - PARAMETER CONDITIONS MIN. TYP.
TDA1564J
MAX.
UNIT
18.0 150 50 - 100 100
V mA A V mV mV
1 3 VP 40
V V V A V mA V
0.5 - 2.5
- -
C C
2002 Jan 14
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Philips Semiconductors
Preliminary specification
Run-cool stereo power amplifier
TDA1564J
MODE handbook, halfpage (V)
V
18
Operating
4 3 Mute 2 1 Standby 0
MGR176
Fig.4 Switching levels of the mode select pin.
2002 Jan 14
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Philips Semiconductors
Preliminary specification
Run-cool stereo power amplifier
TDA1564J
AC CHARACTERISTICS VP = 14.4 V; RL = 4 ; CCSE = 1000 F; f = 1 kHz; Tamb = 25 C; measured in Fig.7; unless otherwise specified. SYMBOL Po PARAMETER output power CONDITIONS THD = 0.5% THD = 10% EIAJ VP = 13.2 V; THD = 0.5% VP = 13.2 V; THD = 10% THD P Bp fro(l) fro(h) Gv SVRR total harmonic distortion power dissipation power bandwidth low frequency roll-off high frequency roll-off closed-loop voltage gain supply voltage ripple rejection THD = 1%; Po = -1 dB with respect to 15 W -1 dB; note 2 -1 dB Po = 1 W Rs = 0 ; Vripple = 2 V (p-p) on/mute CMRR Zi Zi VSE-BTL Vout Vn(o) common mode rejection ratio input impedance mismatch in input impedance SE to BTL switch voltage level output voltage mute (RMS value) noise output voltage note 3 Vi = 1 V (RMS) on; Rs = 0 ; note 4 on; Rs = 10 k; note 4 mute; note 5 cs Gv Notes 1. The distortion is measured with a bandwidth of 10 Hz to 30 kHz. 2. Frequency response externally fixed (input capacitors determine the low frequency roll-off). 3. The SE to BTL switch voltage level depends on the value of VP. 4. Noise output voltage measured with a bandwidth of 20 Hz to 20 kHz. 5. Noise output voltage is independent of Rs. channel separation channel unbalance Rs = 0 ; Po = 15 W Rs = 0 45 70 90 - - - - - - 40 - 65 - 90 120 1 3 100 100 105 100 70 - - - - 150 - - 150 150 - 150 - 1 dB dB dB k % V V V V V dB dB standby; f = 100 Hz to 10 kHz 45 - - 130 25 Po = 1 W; note 1 MIN. 15 23 - - - - TYP. 19 25 38 16 20 0.1 20 to 15000 25 - 26 MAX. - - - - - - - - - 27 UNIT W W W W W % W Hz Hz kHz dB
see Figs 10 and 11
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Philips Semiconductors
Preliminary specification
Run-cool stereo power amplifier
TDA1564J
handbook, halfpage Io handbook, halfpage V
MGR177
10 s
max
o
t
0 max short-circuit removed short-circuit to ground
DIAG CLIP
0
0 t 500 ms 500 ms 500 ms
t
maximum current
short-circuit to supply pins
MGW246
Fig.5 Clip detection waveforms.
Fig.6 Protection waveforms.
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Philips Semiconductors
Preliminary specification
Run-cool stereo power amplifier
TEST AND APPLICATION INFORMATION
TDA1564J
handbook, full pagewidth
VP1 5
VP2 13
220 nF
2200 F
VP
TDA1564J -
0.5Rs 220 nF 4 IN2- 16 10 OUT2- 100 nF 3.9 100 nF
+
3.9
-
0.5Rs 220 nF IN2+ 17 60 k CIN 3 10 F 60 k IN1- 2 60 k 60 k 25 k Vref
11 OUT2+
+
4 CSE 1000 F
0.5Rs 220 nF
+ -
7 OUT1- 3.9 100 nF 8 OUT1+ 100 nF 3.9
4 0.5Rs 220 nF IN1+ 1
+ -
STANDBY LOGIC 6 MODE Vms
CLIP AND DIAGNOSTIC 12 OC2 22 F 14 OC1 22 F 15 DIAG Rpu Vlogic
MGW247
signal ground 9 GND power ground
Connect Boucherot filter to pin 8 or pin 10 with the shortest possible connection.
Fig.7 Application diagram.
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Philips Semiconductors
Preliminary specification
Run-cool stereo power amplifier
TDA1564J
handbook, full pagewidth
TDA1564J
RL 2000
In1
TDA1565J
In2
sgnd Mute On Off Out1 Out2
sgnd diag GND
VP
MGW248
Dimensions in mm.
Fig.8 PCB layout (component side) for the application of Fig.7.
2002 Jan 14
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Philips Semiconductors
Preliminary specification
Run-cool stereo power amplifier
TDA1564J
handbook, full pagewidth
High efficiency
3.9 In2
100 nF 100 nF 3.9
Cool
220 nF 17
Power
220 nF 1 220 nF
In1
GND 2.7 k
Continuous offset detection
100 nF 3.9 100 nF 4.7 k 24 k Out1
VP
Out2
MGW249
Dimensions in mm.
Fig.9 PCB layout (soldering side) for the application of Fig.7.
2002 Jan 14
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Philips Semiconductors
Preliminary specification
Run-cool stereo power amplifier
TDA1564J
handbook, halfpage
25
MGW250
P (W) 20
(1)
handbook, halfpage
25
MGW251
P (W) 20
(1)
(2)
15
15
(2)
10
10
5
5
0 0 4 8 12 16 Po (W) Input signal 1 kHz, sinusoidal; VP = 14.4 V. (1) For a conventional BTL amplifier. (2) For TDA1564J. 20
0 0 2 4 6 8 Po (W) 10
(1) For a conventional BTL amplifier. (2) For TDA1564J.
Fig.10 Power dissipation as a function of output power; sine wave driven.
Fig.11 Power dissipation as a function of output power; pink noise through IEC-60268 filter.
430
2.2 F
330
2.2 F
470 nF
input
3.3 k
91 nF
3.3 k
68 nF
10 k
output
MGC428
Fig.12 IEC-60268 filter.
2002 Jan 14
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Philips Semiconductors
Preliminary specification
Run-cool stereo power amplifier
TDA1564J
handbook, full pagewidth
VP1 5
VP2 13
220 nF
2200 F
VP
TDA1564J -
IN2- 16 220 nF 4 10 OUT2- 100 nF 3.9 100 nF
+
3.9
-
IN2+ 17 220 nF 60 k 60 k 25 k Vref
11 OUT2+
+
CIN 3 10 F IEC-60268 FILTER IN1- 2 pink noise 220 nF 60 k
4 CSE 1000 F
60 k
+ -
7 OUT1- 3.9 100 nF 8 OUT1+ 100 nF 3.9
4 IN1+ 1 220 nF
+ -
INTERFACE signal ground MS 6 MODE Vms OFFSET 12 OC2 22 F 14 OC1 22 F DIAG 15 DIAG Rpu Vlogic
MGW252
9 GND
power ground
Fig.13 Test and application diagram for dissipation measurements with a music-like signal (pink noise).
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Philips Semiconductors
Preliminary specification
Run-cool stereo power amplifier
TDA1564J
MGW253
handbook, halfpage
150
handbook, halfpage
200
MGW254
IP (mA)
IP (mA) 150
100
3 100
50
50
2
1
0 0 5 10 15 20 VP (V) 25
0 0 1 2 3 4 5 VMODE (V)
VMODE = 5 V; RI = .
VP = 14.4 V (1) Standby. (2) Mute. (3) Operating.
Fig.14 Quiescent current as a function of supply voltage.
Fig.15 Supply current as a function of VMODE.
handbook, halfpage
40
MGW255
102 handbook, halfpage THD + N (%) 10
MGW256
Po (W) 30
(1)
(2)
(3)
20
1
(1)
10
10-1
(2) (3)
0 8 10 12 14 16 VP (V) (1) TDH + N = 10 %. (2) TDH + N = 2.5 %. (3) TDH + N = 0.5 %. 18
10-2 10-2
10-1
1
10
Po (W)
102
(1) f = 10 kHz. (2) f = 1 kHz. (3) f = 100 kHz.
Fig.16 Output power as a function of supply voltage.
Fig.17 THD + noise as a function of output power.
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Philips Semiconductors
Preliminary specification
Run-cool stereo power amplifier
TDA1564J
handbook, halfpage
10
MGW257
handbook, halfpage
28
MGW258
THD + N (%)
(1)
Gv (dB) 26
1
24
(2)
10-1 22
10-2 10
102
103
104 f (Hz)
105
20 10
102
103
104
105 f (Hz)
106
(1) Po = 10 W. (2) Po = 1 W.
Fig.18 THD + noise as a function of frequency.
Fig.19 Voltage gain as a function of frequency.
handbook, halfpage
-20
MGW259
handbook, halfpage
(1)
SVRR (dB) -40
cs (dB)
-20
MGW260
-40
(1) (2)
-60
-60
-80
(2)
-80
-100
-100
-120 10
102
103
104 f (Hz)
105
-120 10
102
103
104 f (Hz)
105
(1) On/Mute. (2) Standby.
(1) Po2 = 10 W. (2) Po2 = 1 W.
Fig.20 SVRR as a function of frequency.
Fig.21 Channel separation as a function of frequency.
2002 Jan 14
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Philips Semiconductors
Preliminary specification
Run-cool stereo power amplifier
TDA1564J
handbook, full pagewidth
(1) VP Vload
(2)
(3)
MBH691
0
-VP VP Vmaster 1/2 VP
0 VP Vslave 1/2 VP
0
0
1
2
t (ms)
3
See Fig.7: Vload = V7 - V8 or V11 - V10 Vmaster = V7 or V11 Vslave = V8 or V10
Fig.22 Output waveforms.
2002 Jan 14
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Philips Semiconductors
Preliminary specification
Run-cool stereo power amplifier
APPLICATION NOTES Advantages of high efficiency 1. Power conversion improvement (power supply): Usually, the fact that the reduction of dissipation is directly related to supply current reduction, is neglected. One advantage is less voltage drop in the whole supply chain. Another advantage is less stress for the coil in the supply line. Even the adapter or supply circuit remains cooler than before due to the reduced heat dissipation in the whole chain because more supply current will be converted into output power. 2. Power dissipation reduction: This is the best known advantage of high efficiency amplifiers. 3. Heatsink size reduction: The heatsink size of a conventional amplifier may be reduced with approximately 50% at Vp=14.4V when the TDA1564J will be used. In that case, the maximum heatsink temperature will remain the same. 4. Heatsink temperature reduction: The power dissipation and the thermal resistance of the heatsink determine the heatsink temperature rise. When the same heatsink size is used from a conventional amplifier, the maximum heatsink temperature decreases and also the maximum junction temperature, which extends the life of this semiconductor device. The maximum dissipation with music-like input signals decreases by 40%. It is clear that the use of the TDA1564J saves a significant amount of energy. The maximum supply current decreases by approximately 32%, that reduces the dissipation in the amplifier as well as in the whole supply chain. The TDA1564J allows a heatsink size reduction of approximately 50% or the heatsink temperature decreases by 40% when the heatsink size hasn't been changed.
TDA1564J
handbook, halfpage
VP = 14.4 V
Supply current reduction of 32%
Power dissipation reduction of 40% at Po = 1.6 W
Same junction temperature
choice
Same heatsink size
Heatsink size reduction of 50%
Heatsink temperature reduction of 40%
MGS824
Fig.23 Heatsink design
Advantage of the concept used by TDA1564J The TDA1564J is highly efficient under all conditions, because it uses a single-ended capacitor to create a non-dissipating half supply voltage. Other concepts rely on the fact that both input signals are the same in amplitude and phase. With the concept of a SE capacitor it means that it doesn't matter what kind of signal processing is done on the input signals. For example, amplitude difference, phase shift or delays between both input signals, or other DSP processing, have no impact on the efficiency.
2002 Jan 14
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Philips Semiconductors
Preliminary specification
Run-cool stereo power amplifier
INTERNAL PIN CONFIGURATIONS PIN 1, 2, 16, 17 and 3 NAME IN1+, IN1-, IN2-, IN2+ and CIN EQUIVALENT CIRCUIT
VP1, VP2
TDA1564J
VP1, VP2 1, 2, 16, 17
3
MGR182
4
CSE
VP2
4
MGW261
6
MODE
6
MGW262
7, 11
OUT1-, OUT2+
VP1, VP2
7, 11
4
MGR185
2002 Jan 14
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Philips Semiconductors
Preliminary specification
Run-cool stereo power amplifier
TDA1564J
PIN 8, 10
NAME OUT1+, OUT2-
EQUIVALENT CIRCUIT
VP1, VP2
8, 10
4
MGR186
12, 14
OC1, OC2
VP2
12, 14
MGW263
15
DIAG
VP2
15
MGW264
2002 Jan 14
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Philips Semiconductors
Preliminary specification
Run-cool stereo power amplifier
PACKAGE OUTLINE DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)
TDA1564J
SOT243-1
non-concave D x Dh
Eh
view B: mounting base side
d
A2
B j E A
L3
L
Q c vM
1 Z e e1 bp wM
17 m e2
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 17.0 15.5 A2 4.6 4.4 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 2.54 e1 e2 Eh 6 j 3.4 3.1 L 12.4 11.0 L3 2.4 1.6 m 4.3 Q 2.1 1.8 v 0.8 w 0.4 x 0.03 Z (1) 2.00 1.45
1.27 5.08
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT243-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 97-12-16 99-12-17
2002 Jan 14
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Philips Semiconductors
Preliminary specification
Run-cool stereo power amplifier
SOLDERING Introduction to soldering through-hole mount packages This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. Soldering by dipping or by solder wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joints for more than 5 seconds.
TDA1564J
The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods SOLDERING METHOD PACKAGE DIPPING DBS, DIP, HDIP, SDIP, SIL Note 1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. suitable suitable(1) WAVE
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Philips Semiconductors
Preliminary specification
Run-cool stereo power amplifier
DATA SHEET STATUS DATA SHEET STATUS(1) Objective specification PRODUCT STATUS(2) Development DEFINITIONS
TDA1564J
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.
Preliminary specification
Qualification
Product specification
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
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Philips Semiconductors
Preliminary specification
Run-cool stereo power amplifier
NOTES
TDA1564J
2002 Jan 14
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Philips Semiconductors
Preliminary specification
Run-cool stereo power amplifier
NOTES
TDA1564J
2002 Jan 14
26
Philips Semiconductors
Preliminary specification
Run-cool stereo power amplifier
NOTES
TDA1564J
2002 Jan 14
27
Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2002
SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
753503/01/pp28
Date of release: 2002
Jan 14
Document order number:
9397 750 08362

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